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BEST CHIPPING TIP EVER - Master Your Short Game Technique \u0026 Stop CHUNKING your chip and pitch shotsThe challenge of preserving signal integrity is exacerbated when the distance from the sensor to the display or storage device is increased, reducing signal strength and multiplying opportunities for interference.
Solutions in these instances include amplifier circuits and low-loss conductors. Use of low-loss conductors becomes a compromise of increasing conductor size to the limits of the available space.
Solutions can be created with alternate geometries to take advantage of the space available. Two examples include employing flat wire and printing conductors directly onto enclosures and cannulae.
Of course, the interconnection needs to be environmentally sealed to prevent shorting and other influences of exposure to fluids.
In medical applications, this typically means saline solution, bodily fluids, and other substances. Successful sealing begins at the design stage by providing appropriate features for the sealing system to be employed.
This may mean including wells designed to accept and contain potting compounds, for example. Using properly selected potting compounds is one of the most practical ways to seal items of this scale.
Mechanical sealing systems using gaskets, for example, would increase the quantity of micro-scale components and further complicate proper assembly.
When selecting appropriate potting compounds, there are several factors to consider. Potting materials come in several different chemistries. Single-part chemistries are typically designed to cure quickly using heat or UV light or over time at room temperature.
Room temperature curing materials experience viscosity changes over time, which adds to process variability and pot life i. Additional complications can arise from cure times that can extend over dozens of hours.
In these cases, sub-assemblies must be carefully fixtured to prevent movement or displacement during the curing process.
However, this approach results in high yield-risk, inefficient use of space, difficult handling, and a great deal of work in process WIP delays.
UV curing materials cure very quickly, typically in a matter of seconds, but require that the entirety of the dispensed material can be exposed to the UV light source and not be in a shadowed area.
As such, UV materials are typically translucent. However, translucent materials can present a significant limitation when seeking to block areas of the image sensor from extraneous light.
Environmental protections that extend beyond potting processes are also required. For instance, the image sensor, LEDs, and electronics in chip-on-tip endoscopes need to reliably withstand medical sterilization and sanitation processes.
This could include the high heat and moisture of an autoclave, ethylene oxide, glutaraldehyde, vaporized hydrogen peroxide, irradiation, and iodine.
In the case of radiating sterilization, the effects of exposure to e-beam and gamma radiation must be carefully considered, as many electronic components are not compatible.
In addition, ionizing radiation can negatively affect the properties of some materials, and especially polymers, so designers must consider this factor when choosing the materials for plastic chip-on-tip medical devices.
Despite the incredibly small image sensors available today, smaller sensor sizes are currently being developed to meet ever-increasing size and weight demands.
While we have begun to approach the practical limits of silicon fabrication technology, improvements in manufacturing methods continue for now.
A combination of manufacturing processes and device architectures determines the size and the speed of microprocessors and, in CMOS image sensors, also significantly influence image quality.
As sensors continue to shrink in size, the applications for them will expand into even smaller medical devices and further size reductions will continue to increase the challenges associated with their termination and packaging.
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It is mandatory to procure user consent prior to running these cookies on your website. Chip-on-tip endoscopy technology relies on microminiature sensors, illumination, and lenses.
Market pressures are driving these critical medical devices to shrink in diameter and cost while maintaining, if not adding, functionality.
Meeting these demands requires ingenuitive engineering and manufacturing techniques. Author Recent Posts.
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